首页> 外文OA文献 >The influence of primary Cu6Sn5 size on the shear impact properties of Sn-Cu/Cu BGA Joints
【2h】

The influence of primary Cu6Sn5 size on the shear impact properties of Sn-Cu/Cu BGA Joints

机译:初生Cu6sn5尺寸对sn-Cu / Cu BGa接头剪切冲击性能的影响

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

A method is presented to control the size of primary Cu6Sn5 in ball grid array (BGA) joints while keeping all other microstructural features near-constant, enabling a direct study of the size of primary Cu6Sn5 on impact properties. For Sn-2Cu/Cu BGA joints, it is shown that larger primary Cu6Sn5 particles have a clear negative effect on the shear impact properties. Macroscopic fracture occurred by a combination of the brittle fracture of embedded primary Cu6Sn5 rods and ductile fracture of the matrix βSn. Cleavage of the Cu6Sn5 rods occurred mostly along (0001) or perpendicular to (0001) with some crack deflection between the two. The deterioration of shear impact properties with increasing Cu6Sn5 size is attributed to (1) the larger microcracks introduced by the brittle fracture of larger embedded Cu6Sn5 crystals, and (2) the less numerous and more widely spaced rods when the Cu6Sn5 crystals are larger, which makes them poor strengtheners.
机译:提出了一种方法来控制球栅阵列(BGA)接头中主要Cu6Sn5的尺寸,同时使所有其他微结构特征保持接近恒定,从而可以直接研究主要Cu6Sn5的尺寸对冲击性能的影响。对于Sn-2Cu / Cu BGA接头,研究表明较大的一次Cu6Sn5初级颗粒对剪切冲击性能具有明显的负面影响。宏观断裂是由嵌入的初级Cu6Sn5棒的脆性断裂和基体βSn的延性断裂共同引起的。 Cu6Sn5棒的裂解主要沿(0001)或垂直于(0001)进行,两者之间有一些裂纹偏转。随着Cu6Sn5尺寸的增加,剪切冲击性能的降低归因于(1)较大的嵌入Cu6Sn5晶体的脆性断裂引起的较大的微裂纹,以及(2)当Cu6Sn5晶体较大时,杆的数量较少且间距较大,这是由于使他们成为可怜的补强者。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号